X-Reflow306 LF Full Convection,
Bench Top, Batch oven with Nitrogen Connections
Especially designed for LEAD FREE Soldering
 |
 |
 |
Technical Specifications
| X-Reflow306 LF and X-Reflow306 LF-AC | |
| Reflow area | 12"x12"x1.75" (305x305x45 mm) |
| Temperature range | 70°C to 350°C |
| Temperature Zones | Preheat1, Preheat2, Soak, Reflow, Cooling – Total of 5 (five) zones |
| Heaters | 2 Heaters (Front and Rear) 3,45kW (230V) and 3,45KW (280V) - Please specify voltage to receive correct heaters. Programmed independently |
| Max. PCB size | 12"x12" (305x305 mm) |
| Supply Requirements | 30 amps, 230V 50/60 Hz (Max power consumption: 6.9 kW) |
| Cooling Cycle | Last (Fifth) Zone |
| Monitoring Window Size | 9.84"x9.84" (280×280 mm) |
| Nitrogen Connection | Standard Connector. Nitrogen pressure:1/2-1bar (7-14.5 psi) |
| Size | L=30"xW=20"xH=12" (L=480mm x W=711mm x H=200mm) |
| Weight (unpacked) | 88 lbs. (40 kg) |
| Computer profile control | Allows pre-programming, storage and recall of up to 250 programs |
| Communication with PC | RS485 port (XKAR X485-USB converter required to connect to PC USB port) |
| Advanced Features | Display of the actual temperature/time numerically or as a graph, Independent off-set for the heaters, RS-485 port for downloading firmware upgrades from a PC, Ready to solder in Nitrogen environment, Variety of ways to monitor process in progress. |